Design And Modeling For 3D Ics And Interposers (Wspc Series In Advanced Integration And Packaging)
Design And Modeling For 3D Ics And Interposers (Wspc Series In Advanced Integration And Packaging)
Design And Modeling For 3D Ics And Interposers (Wspc Series In Advanced Integration And Packaging)

Design And Modeling For 3D Ics And Interposers (Wspc Series In Advanced Integration And Packaging)

  • Publish Date: 2013-10-21
  • Binding: Hardcover
  • Author: Madhavan Swaminathan;Ki Jin Han
Vendor
World Scientific Pub Co Inc
Regular price
$138.10
Sale price
$138.10
Quantity must be 1 or more

Attention: For textbook, access codes and supplements are not guaranteed with used items.

Arrives in 3-7 Business Days

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

Customer Reviews